Elecolit® 323 Silver Filled Epoxy 50gm

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SKU

EOEP00006

Is a 2-component silver filled epoxy adhesive. It has a 96 hour pot life, cures at low temperature and is suitable for semiconductor bonding. It is easily dispensed.

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Details

Is a 2-component silver filled epoxy adhesive. It has a 96 hour pot life, cures at low temperature and is suitable for semiconductor bonding. It is easily dispensed.

Features and Benefits

Suitable for semi conductors (Na+, K+, Cl- <10ppm)

No adverse effects on bond wire adhesion

Passed pressure cooker test (1000h)

More Information

More Information
TDS URL	https://techsil.s3.eu-west-2.amazonaws.com/EB/TDS/EOEP00006-tds.pdf