Is designed to seal plugs, switches, relays and parts on FR4. It is a medium viscosity potting compound with good adhesion to thermoplastic synthetics and demonstrates low shrinkage.
Is designed to seal plugs, switches, relays and parts on FR4. It is a medium viscosity potting compound with good adhesion to thermoplastic synthetics and demonstrates low shrinkage.
Rapid curing epoxy potting compound
Sealant for switches, plugs and relays
Corner bonding, potting & mounting large components
UV/Thermal Cure Dam Compound
Thixotropic, for large or high components
Quartz filled. Chip protection for small Dies